$TSLA $INTC $TSM
Tesla Switches to Intel Foundry and EMIB Technology for Dojo 3!
Tesla's next-generation Dojo 3 supercomputer works with ultra-large chip modules.
TSMC's System-on-Wafer (SoW) technology is insufficient to package these massive modules. Production lines are overwhelmed with CoWoS requests and cannot prioritize Tesla's special orders.
Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology offers greater modularity, flexibility, and scalability, allowing Elon Musk to more aggressively develop the Dojo architecture.
Therefore, Tesla is reducing its reliance on Taiwan Semiconductor by choosing Samsung for production and Intel for packaging due to TSMC's packaging limitations.
Tesla Switches to Intel Foundry and EMIB Technology for Dojo 3!
Tesla's next-generation Dojo 3 supercomputer works with ultra-large chip modules.
TSMC's System-on-Wafer (SoW) technology is insufficient to package these massive modules. Production lines are overwhelmed with CoWoS requests and cannot prioritize Tesla's special orders.
Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology offers greater modularity, flexibility, and scalability, allowing Elon Musk to more aggressively develop the Dojo architecture.
Therefore, Tesla is reducing its reliance on Taiwan Semiconductor by choosing Samsung for production and Intel for packaging due to TSMC's packaging limitations.
$TSLA $INTC $TSM
Tesla Switches to Intel Foundry and EMIB Technology for Dojo 3!
Tesla's next-generation Dojo 3 supercomputer works with ultra-large chip modules.
TSMC's System-on-Wafer (SoW) technology is insufficient to package these massive modules. Production lines are overwhelmed with CoWoS requests and cannot prioritize Tesla's special orders.
Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology offers greater modularity, flexibility, and scalability, allowing Elon Musk to more aggressively develop the Dojo architecture.
Therefore, Tesla is reducing its reliance on Taiwan Semiconductor by choosing Samsung for production and Intel for packaging due to TSMC's packaging limitations.
0 التعليقات
0 المشاركات
522 مشاهدة
0 معاينة