Key developments that have caused AMD stock to decline recently: 1️⃣ $INTC, SoftBank, and $ARM Collaboration Rumors: $Softbank's $2 billion investment in $INTC, and rumors that this partnership could leverage $INTC's foundry facilities for the production of AI chips using the $ARM architecture, have raised concerns about further intensified competition for $AMD. This is seen as a risk to market share. 2️⃣ Order Cut and Analyst Note: Hong Kong GF Securities analyst Jeff Pu's claim that $AMD reduced its MI355X chip orders from $7 billion to $6 billion has weakened the company's growth prospects in the AI chip segment. This news has shaken investor confidence and put pressure on the stock. ​3️⃣ New Licensing Requirements for Sales to China: The US government's requirement that NVDA and AMD apply for licenses for every new-generation chip sale to China could restrict companies' flexibility and revenue streams in the Chinese market. This development makes sales processes more complex. Furthermore, according to some agreements, companies are required to pay 15% of revenue from sales to China to the US government. ​4️⃣ Possible US Government Partnership in $INTC: The US's announcement of its intention to become a partner in $INTC is perceived as a potential risk that could alter the competitive landscape. This could mean supporting $INTC with special taxes imposed on companies like NVDA and AMD, which could increase AMD's costs and negatively impact its competitiveness. #AMD #Stock #Investment #TechNews #Market #INTC #NVDA #SoftBank #ARM #ChipSector

$INTC Softbank Invests in Intel! Japan-based SoftBank Group has signed an agreement to invest $2 billion in US semiconductor giant Intel. The investment was made through the issuance of common stock, with SoftBank paying $23 per share. This transaction gives SoftBank a stake of just under 2% in Intel. Intel shares are up ~6% pre-market.

$TSLA $INTC $TSM Tesla Switches to Intel Foundry and EMIB Technology for Dojo 3! Tesla's next-generation Dojo 3 supercomputer works with ultra-large chip modules. TSMC's System-on-Wafer (SoW) technology is insufficient to package these massive modules. Production lines are overwhelmed with CoWoS requests and cannot prioritize Tesla's special orders. Intel's EMIB (Embedded Multi-Die Interconnect Bridge) technology offers greater modularity, flexibility, and scalability, allowing Elon Musk to more aggressively develop the Dojo architecture. Therefore, Tesla is reducing its reliance on Taiwan Semiconductor by choosing Samsung for production and Intel for packaging due to TSMC's packaging limitations.